JPH01103982U - - Google Patents

Info

Publication number
JPH01103982U
JPH01103982U JP20073387U JP20073387U JPH01103982U JP H01103982 U JPH01103982 U JP H01103982U JP 20073387 U JP20073387 U JP 20073387U JP 20073387 U JP20073387 U JP 20073387U JP H01103982 U JPH01103982 U JP H01103982U
Authority
JP
Japan
Prior art keywords
recorded
time
recording
zoom
recording medium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20073387U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP20073387U priority Critical patent/JPH01103982U/ja
Publication of JPH01103982U publication Critical patent/JPH01103982U/ja
Pending legal-status Critical Current

Links

JP20073387U 1987-12-28 1987-12-28 Pending JPH01103982U (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20073387U JPH01103982U (en]) 1987-12-28 1987-12-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20073387U JPH01103982U (en]) 1987-12-28 1987-12-28

Publications (1)

Publication Number Publication Date
JPH01103982U true JPH01103982U (en]) 1989-07-13

Family

ID=31491125

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20073387U Pending JPH01103982U (en]) 1987-12-28 1987-12-28

Country Status (1)

Country Link
JP (1) JPH01103982U (en])

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6878206B2 (en) 2001-07-16 2005-04-12 Applied Materials, Inc. Lid assembly for a processing system to facilitate sequential deposition techniques
US6911391B2 (en) 2002-01-26 2005-06-28 Applied Materials, Inc. Integration of titanium and titanium nitride layers
US6951804B2 (en) 2001-02-02 2005-10-04 Applied Materials, Inc. Formation of a tantalum-nitride layer
US7033922B2 (en) 2000-06-28 2006-04-25 Applied Materials. Inc. Method and system for controlling the presence of fluorine in refractory metal layers
US7085616B2 (en) 2001-07-27 2006-08-01 Applied Materials, Inc. Atomic layer deposition apparatus
US7262133B2 (en) 2003-01-07 2007-08-28 Applied Materials, Inc. Enhancement of copper line reliability using thin ALD tan film to cap the copper line
US7405158B2 (en) 2000-06-28 2008-07-29 Applied Materials, Inc. Methods for depositing tungsten layers employing atomic layer deposition techniques
US7494908B2 (en) 2001-09-26 2009-02-24 Applied Materials, Inc. Apparatus for integration of barrier layer and seed layer
US7501343B2 (en) 2000-06-27 2009-03-10 Applied Materials, Inc. Formation of boride barrier layers using chemisorption techniques

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5033726A (en]) * 1973-06-06 1975-04-01
JPS5234616A (en) * 1975-09-11 1977-03-16 Sony Corp Magnetic video recording reproduction equipment
JPS60246185A (ja) * 1984-05-21 1985-12-05 Fuji Photo Film Co Ltd 写真画像の映像信号記録装置
JPS61173589A (ja) * 1985-01-28 1986-08-05 Shinko Kaiun Kk ビデオテ−プ録画方法およびその装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5033726A (en]) * 1973-06-06 1975-04-01
JPS5234616A (en) * 1975-09-11 1977-03-16 Sony Corp Magnetic video recording reproduction equipment
JPS60246185A (ja) * 1984-05-21 1985-12-05 Fuji Photo Film Co Ltd 写真画像の映像信号記録装置
JPS61173589A (ja) * 1985-01-28 1986-08-05 Shinko Kaiun Kk ビデオテ−プ録画方法およびその装置

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7501343B2 (en) 2000-06-27 2009-03-10 Applied Materials, Inc. Formation of boride barrier layers using chemisorption techniques
US7033922B2 (en) 2000-06-28 2006-04-25 Applied Materials. Inc. Method and system for controlling the presence of fluorine in refractory metal layers
US7115494B2 (en) 2000-06-28 2006-10-03 Applied Materials, Inc. Method and system for controlling the presence of fluorine in refractory metal layers
US7405158B2 (en) 2000-06-28 2008-07-29 Applied Materials, Inc. Methods for depositing tungsten layers employing atomic layer deposition techniques
US6951804B2 (en) 2001-02-02 2005-10-04 Applied Materials, Inc. Formation of a tantalum-nitride layer
US6878206B2 (en) 2001-07-16 2005-04-12 Applied Materials, Inc. Lid assembly for a processing system to facilitate sequential deposition techniques
US7085616B2 (en) 2001-07-27 2006-08-01 Applied Materials, Inc. Atomic layer deposition apparatus
US7494908B2 (en) 2001-09-26 2009-02-24 Applied Materials, Inc. Apparatus for integration of barrier layer and seed layer
US6911391B2 (en) 2002-01-26 2005-06-28 Applied Materials, Inc. Integration of titanium and titanium nitride layers
US7262133B2 (en) 2003-01-07 2007-08-28 Applied Materials, Inc. Enhancement of copper line reliability using thin ALD tan film to cap the copper line

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